Descripción
- Technical Parameters; Basic Parameters; Heating; HR; Dimension; L580mmx W430mmx H650mm; Weight; 30kg; Total weight; About 35 kg, vary with the differen need of the users; Electrical Parameters; Power; 220V AC; Upper Heating; HR; Size of upper (IR); Consumption of upper (IR); Nozzle of upper(HR); 4pcs: 19x19, 29x29,34x34,37x37 mm; Consumption of upper (HR); 800W; Bottom Heating; HR; Nozzle of bottom(HR); 1 pcs: 50x50 mm; Consumption of bottom (HR); 800W; Bottom Preheat;
- IR; Consumption of preheat (IR); 2400W; General power; 4KW; Temperature Control; Control mode of Upper; Independent temperature control, high-precision closed-loop control, precision ¡À 0.5%, Alarm; Control mode of Bottom Independent temperature control, high-precision closed-loop control, precision ¡À 0.5%, NO Alarm; Rework Function SMD; Suit for welding, remove or repair packaged devices; such as BGA,PBGA,CSP,multi-layer substrates,
- EMI; metallic shield product and solder/lead free Rework welding;Size of applicable chips ¡Ü80mm x80 mm; Size of applicable PCB; MIN 10mm*10mm MAX 350mm*400mm; Packing list:1¡Á bga rework station; 5¡Á nozzles: 4 pcs top(19,29,34,37mm) and 1 pcs bottom(50mm);6¡Á pcb jig (with screw); 1x vacuum pen; 1¡Á k-type thermocouple; 1x socket head wrench; 1x Computer Cable; 1¡Á CD of manual and software
GOWE Hot Air BGA rework station bga reballing kit for ps3 xbox360
