This is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties. This two-part, thixotropic adhesive of refined pure silver and epoxy resin components is free of solvents and copper or carbon additives. It develops resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates. This product cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields. Easy mix pre-measured pouch. Simple mix and use without any mess. Call (888) 522-6742 for more information.
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